https://stream.echo6.co/videos/watch/3ab4379b-5143-4534-a31e-179b996b446e Dave looks at some issues with fanning out tiny 0.4mm pitch BGA packages, via pad and hole size, tenting, breakouts, solder mask expansion etc. And then compares it with an 1136 pin Xilinx Virtex 5 FPGA with 1mm pitch to show the difference in PCB process technologies needed. FPGA Implementation Tutorial - EEVblog #193 https://www.youtube.com/watch?v=7AFGcAyK7kE Forum: http://www.eevblog.com/forum/blog/eevblog-1029-bga-pcb-fanout/ EEVblog Main Web Site: http://www.eevblog.com The 2nd EEVblog Channel: http://www.youtube.com/EEVblog2 Support the EEVblog through Patreon! http://www.patreon.com/eevblog Donate With Bitcoin & Other Crypto Currencies! https://www.eevblog.com/crypto-currency/ EEVblog Amazon Store (Dave gets a cut): http://astore.amazon.com/eevblogstore-20 T-Shirts: http://teespring.com/stores/eevblog 💗 Likecoin – Coins for Likes: https://likecoin.pro/@eevblog/dil9/hcq3 Thu, 07 May 2026 06:31:32 GMT https://validator.w3.org/feed/docs/rss2.html PeerTube - https://stream.echo6.co https://stream.echo6.co/client/assets/images/icons/icon-512x512.png https://stream.echo6.co/videos/watch/3ab4379b-5143-4534-a31e-179b996b446e All rights reserved, unless otherwise specified in the terms specified at https://stream.echo6.co/about and potential licenses granted by each content's rightholder.